Thursday, November 14, 2019
 

Smart Manufacturing II (Hardware-Centric)

12:15
Wafer-Level Package handling and inspection/metrology platforms
  Thomas Brillouet, R&D Manager, Recif Technologies
Wafer-Level Package handling and inspection/metrology platforms
Thomas Brillouet

Thomas Brillouet
R&D Manager
Recif Technologies

Thomas Brillouet

Abstract
The recent developments within the European Collaborative project TSV-Handy regarding the handling of different sizes and types of substrates, combined with integrated inspection and metrology, address several requirement aspects for Smart Manufacturing.The two main challenges of 3D ICs manufacturing, TSV and Fan-Out Wafer Level Packaging techniques, is the multiplication of heterogeneous types of substrates which are presenting different mechanical behaviours and physical properties, and the lack of efficient and clean handling solution in the back-end market. A modular equipment, which is able to manipulate as many types of wafers as possible, without any hardware reconfiguration and managed by a smart adaptive software, will help the end-users in gaining equipment flexibility, up-time and yield.This presentation will give an outlook on how the modular approach responds to these challenges.

Biography
Working for RECIF Technologies since 2000, Thomas BRILLOUET has evolved along with the company. Graduated in electrical and automatic engineering, he then started as a Field Service Engineer for RECIF USA, prior to becoming Technical Coordinator of the East Coast area. Thomas left the USA in 2005, and then successfully managed several Field Task Forces in different Asian countries.This strong field experience drove him to Development & Project Management. Named R&D Manager in RECIF HQ in 2012 he took in charge products developments since then and committed in multiple European Collaborative Projects, through different frameworks. He contributed in those programs as work-package or task leader from the very first EEMI450 through each 450mm development and demonstration program (NGC450 among them), and today TSV-HANDY.

12:40
Smart Manufacturing setups to achieve an AI based Digital Transmission within the EMS-industry
  Markus M. Hoffmann, Head of Business Development Asia-Pacific, Zollner Elektronik AG
Smart Manufacturing setups to achieve an AI based Digital Transmission within the EMS-industry
Markus M. Hoffmann

Markus M. Hoffmann
Head of Business Development Asia-Pacific
Zollner Elektronik AG

Markus M. Hoffmann

Abstract
1) DIGITAL TRANSMISSION within the EMS INDUSTRYWhat are the everyday challenges of an EMS company?2) INDUSTRY 4.0 & MADE IN CHINA 2025How geopolitical frame-conditions influence technical progress3) METHODS & TOOLSValue Stream MappingDigital FactoryMTMDFx4) SUPPORT TECHNOLOGY & AUTOMATIZATIONDigital TwinAutomized components handlingAugmented RealityCo-Robotics Solution5) AI & DEEP LEARNING WITHIN EMSThe 4 V´s of big dataAI support for qualityDeep Learning and Big Data for Predictive Maintenance6) INDUSTRY 5.0 supported by AIOptimize RFP-processesUsing 5G to increase automatizationNew business modell arise from Big Data7) Executive SummaryWhat does AI mean for the EMS-sectorWhat transition is needed to keep up the pace

Biography
Markus M. Hoffmann has more than 15 years of experience within the EMS-market, focusing on global direct customer care management. Developed and established processes as overall head for involved operational units in Eastern Europe, Asia & North America, Markus has built key account relationships with new and existing customers mainly within the Semiconductor (front- and back end) business. His latest role in Zollner is to force deep engagement in the definition and pursuit process for the EMS market in the Asia Pacific Region. Markus pursues business in the dedicated geographical area and market in accordance with the assigned Business Unit’s strategy same as identify new potential Business for key-sectors like Railway, Aerospace, Healthcare & Semidconductor. Beside his activities at Zollner, Markus acts as an International Observer Columnist & Podcast Panelist for Chinese International Radio (CRI). Markus was also part in this years SEMICON SEA (Advanced Packaging Forum) & SEMICON Taiwan (SiP Global Summit) as a Speaker and Panelist, sharing his idead on Smart Manufacturing & Hetergenous Integration.

13:05 TBD
  TBD
 

13:30 TBD
  Fabmatics
13:55 TBD
  TBD
14:25

End